CXMT gains real breakthrough in memory chips with LPDDR6

CXMT is working on LPDDR6 and it appears to be a real breakthrough for the company in memory chips. The Chinese chipmaker has sped up the R&D progress for the new-gen memory processor, pushing it one step closer to mass production.

LPDDR6 memory chips will go through four main stages in CXMT: individual chip validation, R&D validation, small-batch test validation, and full-scale mass production.

The respective chip has completed the R&D validation phase, where it has gone through tests like compatibility verification, system stability checks, performance, mechanical reliability, and power consumption analysis.

R&D validation phase comprehensively verifies the soundness and reliability of the product design and recognizes potential risks in advance. The specific phase completion suggests that CXMT is actively advancing LPDDR6 memory chips.

LPDDR6 parameters include a design speed of 12800Mbps and a baseline operating speed of 10667 Mbps (when linked with any SoC). It has a die density of 16GB and a total chip capacity of 16GB with 1295-ball PoP (package-on-package).

The new-gen chip claims to deliver significant improvements regarding low-power design and RAS (Reliability, Availability, and Serviceability) compared to LPDDR5X.

Previous Details

CXMT unveiled its LPDDR5 memory chip series in late 2023, featuring 12GB dies (per die data rates of 6400 Mbps) and 12GB PoP chips. Last year, the Chinese chip manufacturer introduced the LPDDR5X series with 12GB and 16GB potential.

It achieved a peak data rate of 10667Mbps, which is a 66% increase over the LPDDR5 and reduces power consumption by another 30%. In the current scenario, CXMT is trying to pick up the pace with its new memory chip against its fastest-growing rival – SK Hynix.

The Chinese OEM already owns a 7.67% global market share, and it may rise to 18% by the end of 2028. LPDDR6 debut will likely bring more progress to the company in the time ahead.

(Image Credits: CXMT)